OPTIwet ST30 - Spin Wet
System zur nasschemischen Behandlung von Wafern bis zu 12" oder Substraten bis zu 9"x9".
Üblicherweise wird dieses System für Reinigungs- und Entwicklungsprozesse in der Einzelwafer Bearbeitung eingesetzt ist aber auch für viele andere Anwendungsbereiche geeignet.
Auf Wunsch kann das System zusätzlich mit eine Be- und Entladeroboter zu einem vollautomatischen Tool erweitert werden.
Product Information
The future technology in the semiconductor industry and production-Spin Wet Process System within process:
OPTIwet ST30
- Stand - Alone Spin Wet Process System for substrates up to Ø 16” (Ø 400 mm) and up to 12” x 12” (300 mm x 300 mm)
System consists of:
- Stand-Alone cabinet with all process modules integrated
- Process chamber made of polypropylene (PP) with safety door
- Including one programmable electronic media arm – Programmable in speed and position
- Emergency Stop Button
- Input display unit with touch screen
- USB 2.0 port for data exchange
- Including software for PC / Notebook – For more comfortable recipe writing and storage
- Including an ENGLISH or GERMAN manual via download
- Price without installation and training
- Requires at least one chuck
Technical data:- Voltage: UAC= 3 x 400 V / N / PE / 50 Hz / 16A
- Speed: 1 – 4.000 rpm – Adjustable in 1 rpm steps (pending on substrate size and load)
- Acceleration ramp: 1 up to 3.000 rpm/s –
- Adjustable in 1 rpm/s steps (pending on substrate size and load)
- Spinning time: 1 up to 999 s – Adjustable in 0.1 s steps
- Substrate size: Up to Ø 12” (Ø 300 mm) or 9” x 9” (225 mm x 225 mm)
- Process bowl exhaust:2 x outer diameter OD 110 mm, each 200m3/h
- Chamber exhaust: 2 x outer diameter OD 140 mm, each 300m3/h
- Cabinet exhaust: Outer diameter OD 110 mm, 200m3/h
- Controller exhaust: Outer diameter OD 110 mm, 200m3/h
- Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
- Vacuum: -0.8 ± 0.2 bar
- Nitrogen (N2): 4.0 ± 0.5 bar
- Media drain connection to the house drain
- CE marked system