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OPTIspin ST32+ - Spin Coating

OPTIspin ST32+ - Spin Coating

  • Product Information

    The future technology in the semiconductor industry and production-
    Stand Alone Spinner system for coating, cleaning and developing within process:

    OPTIspin ST 32+

    • Stand - Alone Spin Coating System for wafers up to Ø 12" (Ø 300 mm) and substrates up to 9" x 9" (225 mm x 225 mm), for traditional open bowl spinning 

    System consists of:

    • Stand Alone cabinet with all process modules integrated
    • Spinner system with process bowl cover (hardware interlock secured)
    • Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
    • Input display unit with touch for spin coater
    • Temperature controller and timer for hotplate
    • USB 2.0 port for data exchange
    • Hotplate OPTIhot HB 30 with lifting pins for 4" up to 12"
    • Including software for PC / Notebook - For more comfortable recipe writing and storage
    • Including an ENGLISH manual on standard paper and a CD-ROM
    • Price without installation and training
    • Requires at least one chuck (Not included !)

    Technical Data:

    • Voltage: UAC= 230 V / N / PE / 50 Hz (60 Hz) / 16A
    • Motor speed: 1 - 6,000 rpm - Adjustable in 1 rpm steps (depending on substrate size and load)
    • Motor acceleration ramp: 1 up to 2,500 rpm/s - Adjustable in 1 rpm/s steps (depending on substrate size and load)
    • Spinning time: 1 up to 999 s - Adjustable in 0.1 s steps
    • Substrate size: Up to Ø 12" (Ø 300 mm) or 9" x 9" (225 mm x 225 mm)
    • Process bowl: Standard made of Polypropylene (PP)
    • Process exhaust: Outer diameter OD 110 mm, 200m3/h
    • Cabinet exhaust #1: Outer diameter OD 110 mm, 200m3/h
    • Cabinet / HP exhaust #2: Outer diameter OD 110 mm, 200m3/h
    • Drain: 5 liter waste tank and high-level sensor, inside the cabinet
    • Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
    • Vacuum: -0.8 ± 0.2 bar
    • Nitrogen (N2): 4.0 ± 0.5 bar
    • CE marked system

    Hotplate:

    • Temperature range: Up to 300°C - Adjustable in 1°C steps
    • Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
    • For wafer: Up to Ø 12" (Ø 300 mm)
    • For substrate: Up to 9" x 9" (225 mm x 225 mm)
    • Lifting pins: From Ø 4" up to Ø 12"

    Chuck: Option

    Dispense: Option

    Nozzle: Option


    Hotplate: Option

This is a customizable product with a very large amount of options available. Please contact our sales department for more information and support to get a product customized to your needs.

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