top of page
OPTIcoat ST32 - Spin Coating

OPTIcoat ST32 - Spin Coating

  • Product Information

    The future technology in the semiconductor industry and production-
    Stand-Alone Spin Coating System "Covered Chuck" and Hotplate within process:

    OPTIcoat ST 32

    • Stand - Alone Spin Coating System with "Covered Chuck" 
      technology with Hotplate for Wafers up to Ø 12" (Ø 300 mm) 
      and substrates up to 9" x 9" (225 mm x 225 mm), for traditional 
      open bowl or covered chuck spinning 


    System consists of:

    • Stand - Alone cabinet with all process modules integrated
    • Spinner system with "Covered Chuck" technology and automatic substrate pin lift
    • Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
    • Hotplate OPTIhot HB 30 with lifting pins for 4" up to 12"
    • Input display unit with touch for spin coater
    • Temperature controller and timer for hotplate
    • Including software for PC / Notebook - For more comfortable
      recipe writing and storage
    • Including an ENGLISH manual on standard paper and a CD-ROM
    • Price without installation and training
    • Requires at least one chuck (Not included !)


    Technical Data:

    • Voltage: UAC= 3 x 400 V / N/PE/50 Hz (60Hz)/16A
    • Motor-Speed: 1 up to 6,000rpm in 1rpm steps 
    • Motor-Acceleration ramp: 1 up to 3,000 rpm/sec in steps 1rpm/sec 
    • Substrate size: Up to Ø 12" (Ø 300 mm) or 9" x 9" (225 mm x 225 mm)
    • Process bowl: Standard made of Polypropylene (PP)
    • Process exhaust: With outer diameter Ø 110 mm, 650m3/h
    • Cabinet exhaust #1: Outer diameter Ø 110 mm, 40m3/h
    • Cabinet / HP exhaust #2: Outer diameter Ø 110 mm, 40m3/h
    • Drain: Standard 5 liter PEHD waste tank with high-level sensor
    • Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
    • Vacuum: -0.8 ± 0.2 bar
    • Nitrogen (N2) Optional: 4.0 ± 0.5 bar
    • CE marked system


    Hotplate:

    • Temperature range: Up to 300°C - Adjustable in 0.1°C steps
    • Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
    • Proximity: Programmable in 0.1 mm steps
    • For Wafer: Up to Ø 12" (Ø 300 mm) 
    • For Substrate: Up to 9" x 9" (225 mm x 225 mm)
    • Lifting pins: For Ø 4" up to Ø 12"


    Chuck: Option

    Dispense: Option

    Nozzle: Option

    Hotplate: Option

This is a customizable product with a very large amount of options available. Please contact our sales department for more information and support to get a product customized to your needs.

bottom of page