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OPTIcoat ST22+ - Spin Coating

OPTIcoat ST22+ - Spin Coating

  • Product Information

    The future technology in the semiconductor industry and production-
    Stand-Alone Spin Coating System with "Covered Chuck" within process:

    OPTIcoat ST 22+

    • Stand - Alone Spin Coating System with "Covered Chuck" technology with Hotplate for Wafers up to Ø 8" (Ø 200 mm) and substrates up to 6" x 6" (150 mm x 150 mm), for traditional open bowl or covered chuck spinning and advanced proximity baking


    System consists of:

    • Stand - Alone cabinet with all process modules integrated
    • Spinner system with "Covered Chuck" technology and automatic substrate pin lift
    • Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
    • Hotplate OPTIhot HB 20+ with programmable lifting pins (proximity)for 2" - 8" Wafer 
    • Programmable Nitrogen (N2) blow
    • Input display unit with touch for each system
    • USB 2.0 port for data exchange
    • Including software for PC / Notebook - For more comfortable recipe writing and storage
    • Including an ENGLISH manual on standard paper and a CD-ROM
    • Price without installation and training
    • Requires at least one chuck (Not included !)



    Technical Data:

    • Voltage: UAC= 3 x 400 V / N / PE / 50 Hz (60 Hz) / 16A
    • Motor-Speed: 1 up to 10,000rpm in 1rpm steps
    • Motor-Acceleration ramp: 1 up to 50,000 rpm/sec in steps 1rpm/sec
    • Spinning time: 1 up to 999 s - Adjustable in 0.1 s steps
    • Substrate size: Up to Ø 8" (Ø 200 mm) or 6" x 6" (150 mm x 150 mm)
    • Process bowl: Standard made of Polypropylene (PP)
    • Process exhaust: Outer diameter OD 110 mm, 200m3/h
    • Cabinet exhaust #1: Outer diameter OD 110 mm, 200m3/h
    • Cabinet / HP exhaust #2: Outer diameter OD 110 mm, 200m3/h
    • Drain: 5 liter waste tank and high-level sensor, inside the cabinet
    • Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
    • Vacuum: -0.8 ± 0.2 bar
    • Nitrogen (N2) Optional: 4.0 ± 0.5 bar
    • CE marked system


    Hotplate:

    • Temperature range: Up to 300°C - Adjustable in 0.1°C steps
    • Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
    • Proximity: Programmable in 0.1 mm steps
    • For Wafer: Up to Ø 8" (Ø 200 mm)
    • For Substrate: Up to 6" x 6" (150 mm x 150 mm)
    • Lifting pins: For Ø 2" up to Ø 8"

    Chuck: Option

    Dispense: Option

    Nozzle: Option

    Hotplate: Option

This is a customizable product with a very large amount of options available. Please contact our sales department for more information and support to get a product customized to your needs.

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