Maximus 804 - Automatic Cluster

MAXIMUS Series 

Automatic Microcluster Systems for Lithography Processes
in the Semiconductor Industry

The fully-automated microcluster systems of the Maximus Series are designed for single-substrate production processes in the semiconductor industry. The system platform handles wafer sizes from Ø 2” up to Ø 750 mm and substrate sizes from 2” x 2” up to 500 mm x 500 mm. According to the process requirements all Maximus systems can be equipped flexibly with different process units like coater, developer, cleaner, hot, cool and primer plates. The Maximus Series provides all features needed for state of the art production tasks like thin-wafer handling, UV curing or Lift-Off.

MAXIMUS 804 

Ø 2” up to Ø 8” |  2” x 2” up to 6” x 6”
Typical substrates: Si, SiGe, SiC, GaN, GaAs, Sapphire

The Maximus 804 is the proven tool with up to 4 process units for standard lithography applications like coating or developing, hot baking and cooling with excellent coating uniformity due to the patented Covered Chuck Technology.  

The System consists of:

• 1 Cabinet MAXIMUS 804
  - made of stainless steel
  - glass doors for process area
  - stainless steel / glass doors for media / maintenance area
• 1 ISEL 3-axis robot, class 1
• 1 End effector vacuum standard for Ø 125mm and Ø 150mm wafer
• 1 Flat touch screen monitor 
• 1 Computer as controller and user interface
• 2 / 3 Cassette loading plates for wafer up to Ø 8" cassette as I/O
• 1 Touch-less video pre-alignment for wafers up to Ø 8"
• 1 Light beacon (red , yellow , green )
• 1 Remote control, for quick log file checking for service and maintenance purposes via modem, ISDN interface or USB stick
• 1 Software for easy programming of station recipes and flow recipes at the system or on a connected PC
• 1 CE marked system
• 1 An ENGLISH manual on standard paper and a CD-ROM

Technical Data:

• Voltage: UAC= 3 x 400 V / N / PE / 50 Hz (60Hz) / 32A
• Spinner Coater System: Motor speed: 1 up to 10,000 rpm in 1rpm steps (depending on substrate size and load)
• Motor acceleration ramp: 1 up to 50,000 rpm/sec in steps 1rpm/sec (depending on substrate size and load) 
• Spinning time: 0.1 up to 999sec in 0.1sec steps
• Process bowl: Made of Polypropylene (PP)
• Standard drain: 5 liter waste tank with high-level sensor inside the cabinet
• Pressure: Clean Dry Air (CDA) 8 ± 2 bar
• Vacuum: -0.8 ± 0.2 bar
• Nitrogen N2 (optional): 4.0 ± 0.5 bar
• Exhaust connection coater module: 1 x OD110mm, 200 m3/h
• Exhaust connection developer module: 1 x OD110mm, 200 m3/h
• Exhaust connection hotplate stacker: 2 x OD110mm, each 200 m3/h
• Exhaust connection cabinet: 3 x OD140mm, each 300 m3/h