MAXIMUS 6003 - Automatic Cluster

MAXIMUS Series 

Automatic Microcluster Systems for Lithography Processes
in the Semiconductor Industry

The fully-automated microcluster systems of the Maximus Series are designed for single-substrate production processes in the semiconductor industry. The system platform handles wafer sizes from Ø 2” up to Ø 750 mm and substrate sizes from 2” x 2” up to 500 mm x 500 mm. According to the process requirements all Maximus systems can be equipped flexibly with different process units like coater, developer, cleaner, hot, cool and primer plates. The Maximus Series provides all features needed for state of the art production tasks like thin-wafer handling, UV curing or Lift-Off.

MAXIMUS 6003 

Ø 300 mm up to Ø 750 mm  up to 500 mm x 500 mm
Typical applications: EWLB, Display Production

The Maximus 6003 is the perfect tool for large-sized substrates and can be operated with up to 3 process units. The Maximus 6003 is optimized for the EWLB process and dedicated for display and touch panel applications.

The System consists of:

• 1 Cabinet MAXIMUS 6003
  - made of stainless steel
  - lockable safety glass doors for process area
  - stainless steel / glass doors for media / maintenance area
• 1 Linear 4-axis robot system
• 2 End effector vacuum for Ø 300mm wafer with wafer detection sensor
• 1 Flat touch screen monitor 
• 1 Computer as controller and user interface
• 2 FOUP loading stations for Ø 300mm wafer as I/O port with 8" adapter plates
• 1 Touch less video pre-alignment for wafers up to Ø 300mm
• 4 Light beacon (red , yellow , green )
• 1 Remote control, for quick log file checking for service and maintenance purposes via modem or ISDN interface
• 1 Software for easy programming of station recipe and flow recipe
• at the system or on a connected PC
• 1 CE marked system
• 1 ENGLISH manual on standard paper and a CD-ROM

Technical Data:

• Voltage: UAC= 3 x 400 V / N / PE / 50 Hz / 32A
• Spinner Coater System: Motor speed: 1 up to 10,000rpm in 1rpm steps (depending on substrate size and load)
• Motor acceleration ramp: 1 up to 50,000 rpm/sec in steps 1rpm/sec (depending on substrate size and load)
• Spinning time: 0.1 up to 999sec in 0.1sec steps
• Process bowl: Made of Polypropylene (PP)
• Standard drain: 5 liter waste tank with high-level sensor inside the cabinet
• Pressure: Clean Dry Air (CDA) 8 ± 2 bar
• Vacuum: -0.8 ± 0.2 bar
• Nitrogen N2 (optional): 4.0 ± 0.5 bar
• Exhaust coater module #1: 1 x OD110mm, 80 m3/h
• Exhaust coater module #2: 1 x OD110mm, 80 m3/h
• Exhaust developer module #1: 1 x OD110mm, 80 m3/h
• Exhaust hotplate stacker: 2 x OD110mm, each 80 m3/h
• Exhaust cabinet: 2 x OD160mm, each 20 m3/h
• Exhaust: OD250mm, 1000 m3/h