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OPTIspin ST32 - Spin Coating

OPTIspin ST32 - Spin Coating

  • Product Information

    The future technology in the semiconductor industry and production-
    Stand Alone Spinner system for coating, cleaning and developing within process:

    OPTIspin ST 32

    • Stand - Alone Spin Coating System for wafers up to Ø 12" (Ø 300 mm) and substrates up to 9" x 9" (225 mm x 225 mm), for traditional open bowl spinning

    System consists of:

    • Stand Alone cabinet with all process modules integrated
    • Spinner system with process bowl cover (hardware interlock secured)
    • Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
    • Input display unit with touch for spin coater
    • Temperature controller and timer for hotplate
    • USB 2.0 port for data exchange
    • Hotplate OPTIhot HB 30 with lifting pins for 4" up to 12"
    • Including software for PC / Notebook - For more comfortable recipe writing and storage
    • Including an ENGLISH manual on standard paper and a CD-ROM
    • Price without installation and training
    • Requires at least one chuck (Not included !)

    Technical Data:

    • Voltage: UAC= 230 V / N / PE / 50 Hz (60 Hz) / 16A
    • Motor speed: 1 - 6,000 rpm - Adjustable in 1 rpm steps (depending on substrate size and load)
    • Motor acceleration ramp: 1 up to 2,500 rpm/s - Adjustable in 1 rpm/s steps (depending on substrate size and load)
    • Spinning time: 1 up to 999 s - Adjustable in 0.1 s steps
    • Substrate size: Up to Ø 12" (Ø 300 mm) or 9" x 9" (225 mm x 225 mm)
    • Process bowl: Standard made of Polypropylene (PP)
    • Process exhaust: Outer diameter OD 110 mm, 200m3/h
    • Cabinet exhaust #1: Outer diameter OD 110 mm, 200m3/h
    • Cabinet / HP exhaust #2: Outer diameter OD 110 mm, 200m3/h
    • Drain: 5 liter waste tank and high-level sensor, inside the cabinet
    • Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
    • Vacuum: -0.8 ± 0.2 bar
    • Nitrogen (N2): 4.0 ± 0.5 bar
    • CE marked system

    Hotplate:

    • Temperature range: Up to 300°C - Adjustable in 1°C steps
    • Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
    • For wafer: Up to Ø 12" (Ø 300 mm)
    • For substrate: Up to 9" x 9" (225 mm x 225 mm)
    • Lifting pins: From Ø 4" up to Ø 12"


    Chuck: Option

    Dispense: Option

    Nozzle: Option

    Hotplate: Option

Dies ist ein kundenspezifisches Produkt bei dem eine sehr hohe Anzahl an Optionen zur Verfügung steht. Bitte kontaktieren Sie unseren Vertrieb für weitere Informationen und Unterstützung um ein auf Ihre Bedürfnisse angepasstes Produkt zu erhalten.

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