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OPTIhot HB30+ - Hotplate

OPTIhot HB30+ - Hotplate

  • Product Information

    The future technology in the semi conductor industry and production-
    bench mounted Hotplate System for typical lithography baking applications:

    OPTIhot HB 30+

    • Bench Mounted Hotplate System for wafer up to Ø 12" 
      (Ø 300 mm) and substrates up to 9" x 9" (225 mm x 225 mm)

    System consists of:

    • Hotplate System with cover
    • Recipe programmable lifting pins (proximity) for 4" - 12" wafer 
    • Recipe programmable Nitrogen (N2) blow
    • 19" controller unit
    • Input display unit with touch panel
    • Preset and calibrated Temperature Controller
    • Including software for PC / Notebook - For more comfortable recipe writing and storage
    • Including an ENGLISH manual on standard paper and a CD-ROM
    • Price without installation and training

    Technical data:

    • Voltage: UAC= 110 V / N / PE / 60 Hz / 16A or UAC= 230 V / N / PE / 50 Hz / 16A 
    • Temperature range: Up to 300°C - Adjustable in 1°C steps
    • Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
    • Lifting pins (Proximity): From Ø 4" up to Ø 12" - Programmable in 0.1 mm steps
    • Substrate size: Up to Ø 12" (Ø 300 mm) or 9" x 9" (225 mm x 225 mm)
    • Process exhaust: Outer diameter OD 38mm, 30m3/h
    • Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
    • Vacuum: -0.8 ± 0.2 bar
    • Nitrogen (N2): 4.0 ± 0.5 bar
    • CE marked system

Dies ist ein kundenspezifisches Produkt bei dem eine sehr hohe Anzahl an Optionen zur Verfügung steht. Bitte kontaktieren Sie unseren Vertrieb für weitere Informationen und Unterstützung um ein auf Ihre Bedürfnisse angepasstes Produkt zu erhalten.

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