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OPTIcoat ST32+ - Spin Coating

OPTIcoat ST32+ - Spin Coating

  • Product Information

    The future technology in the semiconductor industry and production-
    Stand-Alone Spin Coating System "Covered Chuck" and Hotplate within process:

    OPTIcoat ST 32+

    • Stand - Alone Spin Coating System with "Covered Chuck"
      technology with Hotplate for wafers up to Ø 12" (Ø 300 mm)
      and substrates up to 9" x 9" (225 mm x 225 mm), for traditional
      open bowl or covered chuck spinning 


    System consists of:

    • Stand - Alone cabinet with all process modules integrated
    • Spinner system with "Covered Chuck" technology and automatic substrate pin lift
    • Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
    • Hotplate OPTIhot HB 30 with programmable lifting pins (proximity) for 4" - 12" Wafer 
    • Programmable Nitrogen (N2) blow
    • Input display unit with touch for each system
    • Including software for PC / Notebook - For more comfortable
      recipe writing and storage
    • Including an ENGLISH manual on standard paper and a CD-ROM
    • Price without installation and training
    • Requires at least one chuck (Not included !)


    Technical Data:

    • Voltage: UAC= 3 x 400 V / N/PE/50 Hz (60Hz)/16
    • Motor-Speed: 1 up to 6,000rpm in 1rpm steps 
    • Motor-Acceleration ramp: 1 up to 3,000 rpm/sec in steps 1rpm/sec 
    • Substrate size: Up to Ø 12" (Ø 300 mm) or 9" x 9" (225 mm x 225 mm)
    • Process bowl: Standard made of Polypropylene (PP)
    • Process exhaust: With outer diameter Ø 110 mm, 650m3/h
    • Cabinet exhaust #1: Outer diameter Ø 110 mm, 40m3/h
    • Cabinet / HP exhaust #2: Outer diameter Ø 110 mm, 40m3/h
    • Drain: Standard 5 liter PEHD waste tank with high-level sensor
    • Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
    • Vacuum: -0.8 ± 0.2 bar
    • Nitrogen (N2): 4.0 ± 0.5 bar
    • CE marked system


    Hotplate:

    • Temperature range: Up to 300°C - Adjustable in 0.1°C steps
    • Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
    • Proximity: Programmable in 0.1 mm steps
    • For Wafer: Up to Ø 12" (Ø 300 mm) 
    • For Substrate: Up to 9" x 9" (225 mm x 225 mm)
    • Lifting pins: For Ø 4" up to Ø 12"

Dies ist ein kundenspezifisches Produkt bei dem eine sehr hohe Anzahl an Optionen zur Verfügung steht. Bitte kontaktieren Sie unseren Vertrieb für weitere Informationen und Unterstützung um ein auf Ihre Bedürfnisse angepasstes Produkt zu erhalten.

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