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OPTIcoat ST23+ - Spin Coating

OPTIcoat ST23+ - Spin Coating

  • Product Information

    The future technology in the semiconductor industry and production-
    Stand-Alone Spin Coating System with "Covered Chuck", Hotplate and HMDS within process:

    OPTIcoat ST 23+

    • Stand - Alone Spin Coating System with "Covered Chuck"
      technology with Hotplate and HMDS Hotplate for Wafers up to Ø 8" (Ø 200 mm) and substrates up to 6" x 6" (150 mm x 150 mm), for traditional open bowl or covered chuck spinning



    System consists of:

    • Stand - Alone cabinet with all process modules integrated
    • Spinner system with "Covered Chuck" technology and automatic substrate pin lift
    • Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
    • Hotplate OPTIhot HB 20+ with programmable lifting pins (proximity) or 2" - 8" wafer 
    • Programmable Nitrogen (N2) blow
    • Vapor prime HMDS (HexaMethylDiSilazan) Hotplate OPTIhot VB 20
    • Input display unit with touch for each system
    • USB 2.0 port for data exchange
    • Including software for PC / Notebook - For more comfortable recipe writing and storage
    • Including an ENGLISH manual on standard paper and a CD-ROM
    • Price without installation and training
    • Requires at least one chuck (Not included !)



    Technical Data:

    • Voltage: UAC= 3 x 400 V / N / PE / 50 Hz (60 Hz) / 16A
    • Motor-Speed: 1 up to 10,000rpm in 1rpm steps
    • Motor-Acceleration ramp: 1 up to 50,000 rpm/sec in steps 1rpm/sec
    • Spinning time: 1 up to 999 s - Adjustable in 0.1 s steps
    • Substrate size: Up to Ø 8" (Ø 200 mm) or 6" x 6" (150 mm x 150 mm)
    • Process bowl: Standard made of Polypropylene (PP)
    • Process exhaust: Outer diameter OD 110 mm, 200m3/h
    • Cabinet exhaust #1: Outer diameter OD 110 mm, 200m3/h
    • Cabinet / HP exhaust #2: Outer diameter OD 110 mm, 200m3/h
    • Process exhaust HMDS: Outer diameter OD 110 mm, 200m3/h
    • Cabinet exhaust HMDS: Outer diameter OD 110 mm, 200m3/h
    • Drain: 5 liter waste tank and high-level sensor, inside the cabinet
    • Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
    • Vacuum: -0.8 ± 0.2 bar
    • Nitrogen (N2): 4.0 ± 0.5 bar
    • CE marked system



    Hotplate:

    • Temperature range: Up to 300°C - Adjustable in 0.1°C steps
    • Hotplate time: 1 up to 999 s - Adjustable in 0.1 s steps
    • Proximity: Programmable in 0.1 mm steps
    • For Wafer: Up to Ø 8" (Ø 200 mm)
    • For Substrate: Up to 6" x 6" (150 mm x 150 mm)
    • Lifting pins: For Ø 2" up to Ø 8"



    HMDS (HexaMethylDiSilazan) Vapor Prime Hotplate:

    • Temperature range: Up to 200°C - Adjustable in 0.1°C steps
    • For wafer: Up to Ø 8" (Ø 200 mm)
    • For substrate: Up to 6" x 6" (150mm x 150mm)
    • Lifting pins: For Ø 2" up to Ø 8"

Dies ist ein kundenspezifisches Produkt bei dem eine sehr hohe Anzahl an Optionen zur Verfügung steht. Bitte kontaktieren Sie unseren Vertrieb für weitere Informationen und Unterstützung um ein auf Ihre Bedürfnisse angepasstes Produkt zu erhalten.

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