OPTIcoat ST23 - Spin Coating

The future technology in the semiconductor industry and production-
Stand-Alone Spin Coating System with "Covered Chuck", Hotplate and HMDS within process:

OPTIcoat ST 23

• Stand - Alone Spin Coating System with "Covered Chuck" technology with Hotplate and HMDS Hotplate for Wafers up to Ø 8" (Ø 200 mm) and substrates up to 6" x 6" (150 mm x 150mm), for traditional open bowl or covered chuck spinning 

System consists of:

• Stand - Alone cabinet with all process modules integrated
• Spinner system with "Covered Chuck" technology and automatic substrate pin lift
• Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
• Hotplate OPTIhot HB 20 with lifting pins for 2" up to 8"
• Vapor prime HMDS (HexaMethylDiSilazan) Hotplate OPTIhot VB 20
• Input display unit with touch for spin coater and HMDS hotplate
• Temperature controller and timer for hotplate
• USB 2.0 port for data exchange
• Including software for PC / Notebook - For more comfortable
  recipe writing and storage
• Including an ENGLISH manual on standard paper and a CD-ROM
• Price without installation and training
• Requires at least one chuck (Not included !)

Technical Data:

• Voltage: UAC= 3 x 400 V / N / PE / 50 Hz (60 Hz) / 16
• Motor-Speed: 1 up to 10,000rpm in 1rpm steps
• Motor-Acceleration ramp: 1 up to 50,000 rpm/sec in steps 1rpm/sec
• Spinning time: 1 up to 999 s - Adjustable in 0.1 s steps
• Substrate size: Up to Ø 8" (Ø 200 mm) or 6" x 6" (150 mm x 150 mm)
• Process bowl: Standard made of Polypropylene (PP)
• Process exhaust: Outer diameter OD 110 mm, 200m3/h
• Cabinet exhaust #1: Outer diameter OD 110 mm, 200m3/h
• Cabinet / HP exhaust #2: Outer diameter OD 110 mm, 200m3/h
• Process exhaust HMDS: Outer diameter OD 110 mm, 200m3/h
• Cabinet exhaust HMDS: Outer diameter OD 110 mm, 200m3/h
• Drain: 5 liter waste tank and high-level sensor, inside the cabinet
• Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
• Vacuum: -0.8 ± 0.2 bar
• Nitrogen (N2) Optional: 4.0 ± 0.5 bar
• CE marked system

Hotplate:

• Temperature range: Up to 300°C - Adjustable in 0.1°C steps
• For Wafer: Up to Ø 8" (Ø 200 mm)
• For Substrate: Up to 6" x 6" (150 mm x 150 mm)
• Lifting pins: For Ø 2" up to Ø 8"

Vapor Prime Hotplate:

• Temperature range: Up to 200°C
• For Wafer: Up to Ø 8" (Ø 200 mm)
• For Substrate: Up to 6" x 6" (150 mm x 150 mm)
• For HMDS vapor priming