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OPTIcoat ST22 - Spin Coating

OPTIcoat ST22 - Spin Coating

  • Product Information

    The future technology in the semiconductor industry and production-
    Stand-Alone Spin Coating System with "Covered Chuck" and Hotplate within process:

    OPTIcoat ST 22

    • Stand - Alone Spin Coating System with "Covered Chuck" technology with Hotplate for Wafers up to Ø 8" (Ø 200 mm) and substrates up to 6" x 6" (150 mm x 150 mm), for traditional open bowl or covered chuck spinning 

    System consists of:

    • Stand - Alone cabinet with all process modules integrated
    • Spinner system with "Covered Chuck" technology and automatic substrate pin lift
    • Multi piece process bowl (easily dismountable for cleaning purposes) with splash ring
    • Hotplate OPTIhot HB 20 with lifting pins for 2" up to 8"
    • Input display unit with touch for spin coater
    • Temperature controller and timer for hotplate
    • USB 2.0 port for data exchange
    • Including software for PC / Notebook - For more comfortable recipe writing and storage
    • Including an ENGLISH manual on standard paper and a CD-ROM
    • Price without installation and training
    • Requires at least one chuck (Not included !)

    Technical Data:

    • Voltage: UAC= 3 x 400 V / N / PE / 50 Hz (60 Hz) / 16A
    • Motor-Speed: 1 up to 10,000rpm in 1rpm steps
    • Motor-Acceleration ramp: 1 up to 50,000 rpm/sec in steps 1rpm/sec
    • Spinning time: 1 up to 999 s - Adjustable in 0.1 s steps
    • Substrate size: Up to Ø 8" (Ø 200 mm) or 6" x 6" (150 mm x 150 mm)
    • Process bowl: Standard made of Polypropylene (PP)
    • Process exhaust: Outer diameter OD 110 mm, 200m3/h
    • Cabinet exhaust #1: Outer diameter OD 110 mm, 200m3/h
    • Cabinet / HP exhaust #2: Outer diameter OD 110 mm, 200m3/h
    • Drain: 5 liter waste tank and high-level sensor, inside the cabinet
    • Compressed air: Clean Dry Air (CDA) 8 ± 2 bar
    • Vacuum: -0.8 ± 0.2 bar
    • Nitrogen (N2): 4.0 ± 0.5 bar
    • CE marked system


    Hotplate:

    • Temperature range: Up to 300°C - Adjustable in 0.1°C steps
    • For Wafer: Up to Ø 8" (Ø 200 mm) 
    • For Substrate: Up to 6" x 6" (150 mm x 150mm)
    • Lifting pins: For Ø 2" up to Ø 8"


    Chuck: Option

    Dispense: Option

    Nozzle: Option

    Hotplate: Option

Dies ist ein kundenspezifisches Produkt bei dem eine sehr hohe Anzahl an Optionen zur Verfügung steht. Bitte kontaktieren Sie unseren Vertrieb für weitere Informationen und Unterstützung um ein auf Ihre Bedürfnisse angepasstes Produkt zu erhalten.

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